Job Description

Job Description

Job Description

We're looking for a hands-on and seasoned Thermal Engineer with extensive experience in the semiconductor industry. The ideal candidate will be responsible for the thermal design, analysis, and validation of complex semiconductor packages, modules, and systems. This role requires a deep understanding of both air and liquid cooling methodologies, from initial concept development through to successful deployment in high-volume manufacturing. This position will report to the Thermal/Mechanical Engineering Manager. 

• Perform the thermal design and analysis of semiconductor products, including integrated circuits, packages, modules, and complete systems, ensuring optimal thermal performance and reliability.
• Develop and implement innovative air cooling and liquid cooling solutions for high-power density semiconductor devices, from concept generation to detailed design.
• Conduct thermal simulations using advanced CFD tools (e.g., Icepak, Flotherm, Fluent) to predict temperature distributions, airflow patterns, and heat transfer characteristics.
• Perform thermal design sensitivity analyses, trade-off studies, and optimization to meet performance, cost, and reliability targets
• Perform transient thermal modeling of Rivos packages for thermal/power management.
• Collaborate closely with mechanical, electrical, product engineering, and manufacturing teams to integrate thermal solutions seamlessly into product designs.
• Execute thermal validation testing using wind tunnels, specialized mock-up systems, and other laboratory equipment.
• Utilize data acquisition systems (DAQs), power supplies, thermal cameras, thermocouples, and other relevant instrumentation for accurate thermal measurements.
• Develop and maintain detailed thermal models, documentation, and reports throughout the product development lifecycle.
• Troubleshoot and resolve complex thermal issues during product development, qualification, and field deployment
• Stay abreast of the latest advancements in thermal management technologies, materials, and simulation tools.
• Participate in design reviews, FMEAs, and other quality assurance activities to ensure robust thermal designs.
• Collaborate with CM, OEM and ODM’s to develop mockups, test samples and production parts

• Minimum of 10 years of progressive experience in thermal engineering, specifically within the semiconductor and/or telecom industry.
• Experienced in both air cooling and liquid cooling techniques for high-power electronic devices, covering the entire product lifecycle from development to deployment.
• Experienced in semiconductor packaging. Strong understanding of heat transfer principles (conduction, convection, radiation) and fluid dynamics.
• Proficiency in commercial CFD software packages, including but not limited to Icepak, Flotherm, and other industry-standard tools.
• Hands-on experience with thermal testing methodologies, including the design and execution of experiments using wind tunnels, mock-up systems, and environmental chambers.
• Proven ability to operate and interpret data from Data Acquisition Systems (DAQs), power supplies, thermal cameras, and other relevant thermal measurement equipment.
• Experience with thermal interface materials (TIMs), heat sinks, heat pipes, cold plates, and other thermal management components.
• Useful to have familiarity with OCP thermal/mechanical design guidelines and design of Colo boxes
• Excellent problem-solving skills and a strong analytical mindset.
• Effective written and verbal communication skills, with the ability to present complex technical information clearly and concisely.
• Ability to work independently and as part of a cross-functional team in a fast-paced, dynamic environment.
• Passionate for working in a startup environment. 

• Master's degree in Mechanical Engineering required; Ph.D. is a plus.
• Experience with scripting languages (e.g., Python, MATLAB) for data analysis and automation.
• Experience with CAD tools, particularly SolidWorks, for designing and analyzing thermal components and systems.
• Knowledge of reliability testing and failure analysis related to thermal performance.
• Familiarity with industry standards for thermal management in semiconductors.

We may use artificial intelligence (AI) tools to support parts of the hiring process, such as reviewing applications, analyzing resumes, or assessing responses. These tools assist our recruitment team but do not replace human judgment. Final hiring decisions are ultimately made by humans. If you would like more information about how your data is processed, please contact us.

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